Samsung is reportedly working with key partners to develop a new automotive chip packaging technology. The company is developing an aluminum oxide (Al2O3) coating bonding wire technology that will save costs without compromising on reliability and insulation.
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Moreover, Samsung’s aluminum alternative, which is under development along with Electron, NCD, and LT Metal, does not have explosion problems with composite materials. Aluminum oxide is coated to nanometer thinness on a metal used as a wire.
Compared to silver and copper, aluminum oxide bonds well with insulating coating materials that use epoxy. In addition, the company also plans to use atomic layer deposition to deposit aluminum oxide as a test for various thicknesses.
In chipsets, bonding wires connect I/Os to a lead frame or printed circuit board. In the past, most of them were made of gold (Au) as it brings ductility and conductivity. Meanwhile, gold prices are rising day by day, so OEMs are considering mixing them with a silver (Ag) or copper (Cu).
Composite materials are reported to have weak adhesives with their coating materials, which is why automobile manufacturers will not accept such chipsets because of the potential for explosion in environments with high temperatures and high humidity.
