According to the latest news, Huawei HiSilicon has reportedly started the trial production of its first-ever flexible OLED driver chip. Further, the company is also likely to begin mass production in the first quarter of next year.
As per the info, the foldable OLED chip of Huawei HiSilcon is based on 40nm process technology. The OLED panels have a large number of pixels that emit light independently, but each pixel gets illuminated by the OLED chip driver, so it becomes an important aspect of the display.
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The samples have already been sent for testing to BOE, Huawei, and Honor. This chip is expected to be delivered to the suppliers by the end of the year. Apart from the other OEMs, Huawei itself will be using the HiSilicon’s OLED driver chip in its products.
A report from the Omdia research organization of the year 2020 suggests that the South Korean company is solely leading the OLED driver chip foundry market with a 90% share worldwide. While the rest 10% is taken by TSMC.
Among all of the chip-making companies, Samsung leads the market with a 50% share globally. However, a new Chinese OEM has also entered the market with an aim to capture most of it.
It remains to be seen what the Huawei HiSilicon has to offer and how much share will it capture in this market where it is just a newly born.
(Via)
