According to the latest report, Japan’s Fujifilm Holdings plans to increase the production of semiconductor materials, strengthen the production equipment of factories in Taiwan and the United States, and increase the production capacity of semiconductor substrate abrasives. 90 billion yen will be invested over a two-year period in March 2019, about twice the size of the investment in the past two years.
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The production increase projects are mainly chemical mechanical polishing liquid (CMP Slurry) used for polishing semiconductor substrates, and developer used in the lithography process. In addition to the strengthening of production equipment, the relevant investment will also be invested in research and development purposes.
Moreover, the production of chemical mechanical polishing fluids in the Arizona factory will also expand the scope of the factory and build a new factory to increase production capacity. The global demand for semiconductors continues to rise, and the company aims to achieve 400 billion yen in revenue from the semiconductor material sector in 2030, which is 2.7 times the current figure.
Fujifilm produces 6 kinds of semiconductor materials, and has 11 production sites in Japan, Taiwan, the United States, South Korea, and Europe; among them, due to the rapid expansion of semiconductor production in the United States and Taiwan, Fujifilm has also responded to demand. Eager to expand the supply capacity of semiconductor materials.
Fujifilm’s mid-term business plan is about to end in 2023, and the last year’s goal is to make the revenue of the semiconductor material business reach 150 billion yen. In 2021, the company’s related revenue increased by 23% to 146.7 billion yen, which has almost reached the target. Now, through the increase in investment amount, revenue is expected to rise further.
