MediaTek released the Dimensity 9000+ mobile platform yesterday, inheriting the technical advantages of the Dimensity 9000, and having better performance and energy efficiency.
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According to the revealer @Digital Chat Station, the first Geekbench 5 score of the Dimensity 9000+ chip was released, with a single-core 1300+ and a multi-core 4300+, which can be called the strongest CPU performance of Android at present. Specifically, the single-core running score is 1322, and the multi-core running score is 4331.
As a comparison, Geekbench 5 of the previous Snapdragon 8+ Gen 1 chip was divided into single-core 1333 points multi-core 4211 points, single-core 1336 points multi-core 4151 points, single-core 1339 points multi-core 4196 points. The realme GT2 Master Explorer Edition Snapdragon 8+ is divided into single-core 1296 points and multi-core 4211 points.
Dimensity 9000+ adopts TSMC’s 4nm process and Armv9 architecture. The octa-core CPU includes one Arm Cortex-X2 super core with the main frequency of up to 3.2GHz, three Arm Cortex-A710 large cores, and four Arm Cortex-A510 energy efficiency cores. The advanced CPU architecture of the Dimensity 9000+ and the Arm Mali-G710 flagship ten-core GPU have improved the CPU performance by 5% and the GPU performance by 10% compared to the previous generation.
The Dimensity 9000+ is a new member of the Dimensity 9000 series of flagship 5G mobile platforms, addressing the growing demand for high bandwidth in the smartphone market. Dimensity 9000+ supports LPDDR5X memory, built-in 8MB CPU L3 cache, and 6MB system cache. In addition, it integrates MediaTek’s fifth-generation AI processor APU 590 to provide energy-efficient AI computing power.
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MediaTek Imagiq 790 imaging technology: Equipped with a flagship 18-bit HDR-ISP image processor, it can support up to 320 million pixel cameras, and support the three cameras of smartphones to shoot 18-bit HDR video at the same time. The high-performance ISP has a processing speed of up to 9 billion pixels/second, supports AI noise reduction for 4K HDR video recording, and provides excellent noise reduction for low-light shooting.
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A new generation of 5G modem that supports 3GPP R16: Dimensity 9000+ integrates 5G modem, supports Sub-6GHz 5G full-band high-speed network, supports 3CC three-carrier aggregation (300MHz), the theoretical peak downlink rate can reach 7Gbps, and supports R16 super uplink. Dimensity 9000+ integrates multi-standard dual-SIM dual-pass technology to support multiple combinations of dual-SIM 5G and 4G. Combined with MediaTek 5G UltraSave 2.0 power-saving technology, the power consumption of 5G communication can be greatly reduced.
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MediaTek MiraVision 790 mobile display technology: Dimensity 9000+ supports WQHD+ resolution 144Hz refresh rate display and FHD+ resolution 180Hz refresh rate display, supports MediaTek Intelligent Display Sync 2.0 variable refresh rate technology, and has excellent energy efficiency. In addition, it also supports 4K60 HDR10+ video Wi-Fi wireless projection.
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Wi-Fi 6E, the new Beidou III-B1C GNSS, and Bluetooth 5.3 technology Support next-generation Wi-Fi, Bluetooth technology, and GNSS standards, providing a seamless connection experience for smartphone users.
Smartphones powered by MediaTek’s Dimensity 9000+ flagship 5G mobile platform are expected to be available in the third quarter of 2022.
