Apple will not use the unique dielectric material on its iPhones. According to Apple analyst Ming-Chi Kuo, the iPhones will not adopt Resin Coated Copper (RCC) foil for their printed circuit boards until 2025. The firm will not adopt this technology in 2024 because of its fragile characteristics” and “inability to pass drop tests.
RCC can reduce the thickness of the mainboard and make the drilling process easier because it’s fiberglass-free, writes the analyst. However, RCC will not be adopted in the 2024 iPhone models due to its fragile characteristics and inability to pass drop tests.
But, if Apple and its supplier Ajinomoto can improve the RCC material before the third quarter of 2024, the high-end iPhone 17 models could use it. Resin-coated copper foil does not sound exciting, but it has the potential to slim down the size of circuit boards, freeing up space inside of the Apple iPhones and more.
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