Xiaomi is all set to unveil its first flagship device of 2023, and soon after the launch of Xiaomi 13 Ultra. The Chinese tech giant will shift their focus towards the Xiaomi Civi 3, which is also in talks for weeks, additionally, the device is tipped to feature Dimensity 8200 processor.
Recently, a renowned tipster Wisdom Pikachu shared some information about the new member of the Civi family. As per the report, Xiaomi Civi 3 has also started to prepare for the production schedule and the device will be powered with Mediatek Dimensity 8200 chipset.
This time the company is saying goodbye to the Snapdragon processor, which was used in previous Civi series models. Like the Civi 1 is equipped with Qualcomm Snapdragon 778G, Civi 1S with Snapdragon 778G Plus, and Civi 2 is equipped with Snapdragon 7 Gen1.
MediaTek Dimensity 8200
The MediaTek Dimensity 8200 chipset adopts TSMC’s 4nm process, and the CPU adopts an 8-core design, 1+3+4 three-cluster architecture, 4 Cortex-A78 large cores + 4 Cortex-A55 small cores, One of the A78 large cores has a main frequency of 3.1GHz.
However, it can be said that the performance of Civi 3 has improved significantly. Thus, in terms of running scores, Dimensity 8200 AnTuTu’s comprehensive score can reach more than 900,000 points, while the running score of Qualcomm Snapdragon 7 Gen1 equipped with Civi 2 is less than 600,000 points.
Additionally, the device didn’t adopt major improvements in terms of design, and features a curved screen, with the same resolution, and a centered double-drilled hole for a selfie camera. The rear side is equipped with a triple camera setup, in which the main camera is upgraded to imx8.
However, the design of the rear module and the back cover incorporates an artistic and fresh atmosphere. Besides this, there is no information available so far, but we could expect to get more details in the coming days. It is worth mentioning that Xiaomi Civi 3 has also appeared in the IMEI database with model 23046PNC9C.
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