TSMC sees key customers in line for 3nm process capacity

According to the latest report, citing industry manufacturers, major customers of TSMC, including AMD, Apple, Broadcom, Intel, MediaTek, Nvidia, and Qualcomm, are all queuing for the production capacity of the 3-nanometer process.

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Moreover, according to the plan, TSMC started the risk trial production of the 3nm process technology in the second half of last year and will mass-produce it in the second half of this year to manufacture wafers for customers such as Apple.

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The report shows that many of TSMC’s major customers are paying attention to the 3nm process that will be mass-produced, and the main customers are queuing up for the production capacity of the 3nm process.

According to reports from fab tool manufacturers, Taiwanese media reported that TSMC’s main customers are queuing for 3nm process production capacity. The customers mentioned include Apple, AMD, Nvidia, Broadcom, Qualcomm, MediaTek, and Intel is also mentioned.

Judging from the source before the 3nm risk trial production, TSMC has prepared four waves of production capacity for the 3nm process. Most of the first wave of production capacity will be reserved for Apple, their major customer for many years, and the last three waves of production capacity will also be used by Qualcomm, Intel, NVIDIA, AMD, and other manufacturers to pre-order.

Last week, sources also reported that the trial production of TSMC’s 3nm process is progressing smoothly, and the monthly production capacity in the initial stage of mass production is expected to exceed 25,000 wafers.

Among them, the monthly production capacity of the 3nm process in the Hsinchu Science Park is expected to be 10,000-20,000 wafers at the initial stage of mass production, and the Tainan Science Park is expected to be 15,000 wafers.

Intel is seeking the production capacity of TSMC’s 3nm process, which has also been mentioned by foreign media in previous reports. At the end of last year, Pat Kissinger made his first trip to Asia after taking over as CEO of Intel. At that time, he visited TSMC and held a closed-door meeting with TSMC executives.