Electronics
TSMC’s initial monthly production capacity of 3nm process will surpass 25,000 wafers
According to the latest report, TSMC’s 3nm process technology started risk trial production last year and is currently promoting mass production in the second half of the year as planned. Some sources said in the report that the trial production of TSMC’s 3nm process is progressing smoothly, and the monthly production capacity in the early stage of mass production is expected to exceed 25,000 wafers.
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Moreover, TSMC’s 3nm process technology will be produced in the Hsinchu Science Park and Tainan Science Park factories. The initial monthly production capacity of the 3nm process in Hsinchu Science Park is expected to be 10,000-20,000 wafers. Tainan Science Park is expected to For 15,000 wafers, the total monthly production capacity is 25,000-35,000 wafers.
The 3nm process is mass-produced in Hsinchu Science Park and Tainan Science Park, which means that TSMC has built 3nm process production lines in these two parks. In addition, the 3nm process requires a large number of EUV lithography machines and other advanced equipment. The investment will be quite large.
Considering that TSMC has a huge customer base, only the A-series processors of the major customer Apple have demanded more than 200 million units per year in recent years. The shipments of their 3nm process generation chips are expected to soon increase. More than 300 million pieces, achieving profitability.
For customers of the 3nm process, TSMC CEO Wei Zhejia revealed in the earnings analyst conference call in the first quarter of this year that they continue to see high-level customers are interested in their process technology, and it is expected that the investment in the first year after mass production will be the number of chips will be higher than the same period of 7nm and 5nm process technology.