Qualcomm officially announced the launch of the Qualcomm Snapdragon 778G 5G mobile platform last night, and at the same time announced an upgraded version of the Snapdragon X65 5G modem.
The new version of the baseband chip improves power efficiency, supports a wider range of millimeter-wave carriers, and meets the key requirements of the Chinese market for launching 5G millimeter-wave networks.
Qualcomm officially announced the launch of the Snapdragon X65/X62 5G M.2 interface reference design. This is a wireless network card equipped with X65/X62 5G communication chip.
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It uses the same M.2 interface as the current common Wi-Fi wireless network card, which is easy to quickly apply to laptops, PC desktops, CPE, XR, games, and other Mobile broadband (MBB) terminal equipment.
As can be seen in the figure, in addition to the modem chip, the X65 network card also has 4 IPEX antenna interfaces, as well as RF radio frequency chips, receiving chips, and so on.
The product supports Sub-6GHz and mmWave millimeter-wave 5G signal connections, and the entire circuit board is covered with a shield. According to the official, the product is plug-and-play, which is convenient for OEM manufacturers to quickly launch products with high-performance 5G connectivity.
Qualcomm Snapdragon X62 chip has a millimeter-wave bandwidth of 400MHz, a Sub-6GHz bandwidth of 120MHz, and a peak download rate of 4.4Gbps. The Snapdragon X65 chip complies with 3GPP Release 16 specifications, with a millimeter-wave bandwidth of 1GHz, a Sub-6GHz bandwidth of 300MHz, and a peak download rate of 10Gbps. Both chips are manufactured using 4nm process technology.
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