The current production capacity of chip foundries is generally tight, and there is an urgent need to expand production capacity to meet the foundry needs of automotive chips and smartphone processors. Power Semiconductor Manufacturing Co., Ltd. has started a new 12-inch product in March. Fab construction.
And UMC, whose factory was already operating at full capacity in March, also announced that it will invest billions of dollars to expand the production capacity of its 12A factory.
Judging from the news published by UMC on its official website, the 12A factory is a 12-inch wafer fab, and it is expanding the capacity of the sixth phase of the factory.
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UMC also stated on its official website that they plan to invest NT$100 billion, or about US$3.59 billion, to expand the capacity of the 12A plant in the 6th phase. After the capacity expansion, the sixth phase is planned to be put into operation in the second quarter of 2023.
It is worth noting that UMC is cooperating with a number of customers this time to expand the production capacity of the sixth phase of the 12A plant. They stated on the official website that a number of important customers will participate, but they did not mention specific customers.
UMC stated on its official website that a number of important customers will participate in the expansion of production capacity, and they will deposit relevant funds to help ensure that they receive long-term capacity support. The price will also be determined in advance.