According to the latest report, Denso Corporation, a subsidiary of Toyota Motor Group, announced on the 1st that it aims to increase the sales of semiconductors produced by the company from the current 420 billion yen to 20% by 2025. 500 billion yen.
The company will focus on the production of “power semiconductors” for power control and “analog semiconductors” for monitoring batteries, etc., and will advance the development of sensors for autonomous driving in the future.
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Moreover, in order to achieve stable procurement of semiconductors, Denso will also deepen cooperation with professional manufacturers. In February, in order to stably purchase semiconductors, Denso announced that it will invest in a subsidiary established by Taiwan Semiconductor Manufacturing Company (TSMC) to enter Kumamoto Prefecture.
Furthermore, UMC has also announced that the company’s Japanese subsidiary USJC will cooperate with Denso (DENSO) in the manufacture of automotive power semiconductors, and will build an IGBT production line for DENSO.
Among them, DENSO will provide its system-oriented IGBT components and process technology, while USJC will provide a 12-inch wafer fab manufacturing capacity. It is expected to achieve mass production of the IGBT process on 12-inch wafers in the first half of 2023.
This collaboration has been supported by Japan’s Ministry of Economy, Trade, and Industry’s Necessity Semiconductor Carbon Reduction and Retrofit Program. At the time, DENSO President and CEO Koji Arima said, “DENSO is pleased to be one of the first companies in Japan to start mass production of IGBTs on 12-inch wafers.
With the development of mobility technologies, including autonomous driving and electrification, semiconductors are becoming increasingly important in the automotive industry. Through this collaboration, we are contributing to the stable supply of power semiconductors and the electrification of vehicles .”
