MSI shared a lot of details of Intel’s 12th-generation Core processors. It exposed the photos of the processor’s open cover for the first time and also announced the heat dissipation of the LGA1700 socket. The adaption of the buckle, the actual measurement of the heating of the DDR5 memory, etc.
The 12th-generation Core processor uses a brand-new LGA1700 package, and the CPU substrate changes from a square to a rectangle. It can be seen from the open cover comparison chart that the core area of the 12th generation CPU has two versions, C0 and H0, and the size is significantly smaller than that of the 11th generation.
Among them, the C0 core area is 215.25mm 2 and the H0 core area is 162.75mm 2. The former is suitable for i9 series processors with 8 large cores + 8 small cores, and the latter is used for entry-level processors and contains only 6 large cores.
The reason for the significant reduction in the core area is that Intel has switched to the Intel 7 process of the 10nm process in the 12-generation desktop processors, which has significantly increased the transistor density compared to the previous 14nm process technology.
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Moreover, the shrinking of the CPU core area has also brought about the concentration of heat. MSI’s test structure shows that the highest core temperature of the two processors is not the same, one is located above, and the smaller core heating point is on the left.
However, since the chip and the protective cover are closely attached together by a brazing process, the heat can be quickly dissipated. MSI also stated that many of its MPG and MAG series integrated water-cooled radiators have been adapted to the processor with the LGA1700 interface and provide an extended version of the buckle. It should be noted that the installed height of the LGA1700 processor is also different from that of the LGA1200.
Not only that, but MSI also showed an infrared thermal image of DDR5 memory. The most important feature of this generation of memory is that it is equipped with a PMIC power management circuit in the center of the PCB, which provides accurate and stable DC power for the memory, and also supports voltage regulation.
When the DDR5 memory is running, the PMIC circuit generates considerable heat, and the temperature of the power chip and the two inductors is higher than that of the DRAM particles. Therefore, most DDR5 memory requires its own heat sink. However, the MSI demo memory has been pressurized to 1.35V. If the user uses the default voltage of 1.1V.
Since the memory power supply is directly obtained from the motherboard + 5V power supply, the quality of the computer power supply 5V power supply will directly affect the stability of the memory and the upper limit of overclocking. The measured data of MSI also showed that although the 12V power supply of its own power supply fluctuates violently, its 5V output remains stable, which ensures the stability of the memory.
Besides, the price of DDR5 memory with the same volume is 30%-50% more expensive than DDR4. As the shortage of chips continues, its price may rise further. However, it is estimated that by the middle of 2023, the price of DDR5 memory is expected to drop to the current DDR4 level.
