Samsung is recently in news as its joining hands with Intel and TSMC to establish a new standard in the field of semiconductor manufacturing tech to prepare it for advanced chip packaging technologies.
Nikkei Asia reports that all the three heavy-weight companies have revealed on March 3, 2022, that they are going to form a new consortium along with Qualcomm, Arm, Meta, Microsoft, and several other chipset manufacturing players for chip manufacturing and packaging.
The report also revealed that ASE Technology Holding, which is one of the best chip packaging and testing providers, is also joining the bandwagon. This is truly going to set a benchmark in the world and bring an evolution in the chip-making process. Their joining indicates that some incredible is on the way to come.
The reason behind the joining of such mega-companies could be a shortage of chips, and unavailability of SoC stock, as well as delay in product launches, which we have reported earlier on our website.
As we all know the last and the most important stage of chip manufacturing is testing and packaging. Before packaging chips are mounted on the PCBs and are embedded into the electronic device.
There is some amount of limitations in the process. All the transistors cannot be fitted simultaneously to the substrate as they are not produced together, so the assembling company needs to make the way for other required transistors to fit into a limited amount of space, and this is a major challenge for them.
Let me tell you more about this. The new chipsets which are prepared all together require a new packaging standard, which we call ‘UCIe’ (Universal Chiplet Interconnect express), and Creating this ‘UCIe’ standard is critical and strenuous as well.
We will be updating more on this chip stacking consortium in near future. Till then you can nourish yourself by reading our factful content.
